Qualcomm Aims to Compete Against Apple, Intel With Its Snapdragon X Elite Processor

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Qualcomm disclosed its new Snapdragon X Elite platform at its Snapdragon Summit 2023 in Maui, Hawaii, United States. The company had introduced the Snapdragon X branding earlier this month. The Qualcomm Snapdragon X Elite platform showcases the company’s Oryon CPU and pledges a performance enhancement of up to double compared to its nearest rivals. So far, Qualcomm has only shared some sample designs and benchmarks, but we anticipate the publication of live benchmarks in the upcoming days.

Qualcomm’s Snapdragon 8 Elite chip is constructed on a 4nm process, with 12 high-performance cores running at 3.8GHz and a memory bandwidth of up to 136GB/s. The chipmaker demonstrated some remarkable figures during the keynote, including 50% “faster peak multi-threaded performance” in contrast to Apple Silicon M2, and up to twice the CPU performance compared to Intel Core i7-13800H. However, it is essential to mention here that the Snapdragon X Elite possesses 50% more cores than Apple’s M2 chip.

Oryon, Qualcomm’s newest Arm CPU core, is designed by Nuvia, the firm that it acquired in 2021. The Snapdragon X Elite SoC is equipped with 12 Oryon cores, divided into three sections with four cores each. Snapdragon X Elite appears to be a considerable leap in improvement compared to the company’s previous 8XC chips. As a laptop chip, Snapdragon X Elite SoC seems formidable, but we will have to await a comprehensive hands-on and live benchmarks.

In terms of graphics, Qualcomm asserts that its latest chipset offers up to twice the performance of an Intel Core i7-13800H with 74% less power consumption.

Qualcomm remains intensely focused on incorporating an AI element into its latest chips. The Snapdragon X Elite is capable of executing generative AI models with over 13 billion parameters on the device itself. The company’s most recent premium mobile chipset, the Snapdragon 8 Gen 3, similarly incorporates on-device generative AI features.

During the day 1 keynote, Qualcomm announced various key partners, including Lenovo, who are committed to delivering devices powered by its latest chips. PCs powered by Snapdragon X Elite are projected to commence shipping from mid-2024.

Qualcomm Seamless introduced

Another intriguing announcement during the keynote was Qualcomm Seamless. Termed as a ‘cross-platform’ technology that enables communication between devices across multiple platforms, allowing users to have a seamless experience, Seamless will be compatible with Android, Windows, and Snapdragon-based devices. Qualcomm is collaborating with Microsoft, Google, Dell, Lenovo, and other partners to expand its Seamless technology to more devices. Possible use cases could involve switching wireless earphones between multiple sources, transferring files among different devices, and more.

Snapdragon Seamless comes pre-installed on the company’s new Snapdragon X Elite and Snapdragon 8 Gen 3 platforms. Qualcomm partners like Xiaomi, Lenovo, Microsoft, and others are expected to integrate support for the technology into their upcoming products.

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